Solder Bar SAC07


Lead Free Solder Bars


Leaded Solder Bars


Sn Cu In Ag Sb Bi Zn Fe Al As Cd
99.3±0.1 0.7±0.1 < 0.01 < 0.0001 < 0.02 < 0.01 < 0.005 < 0.02 < 0.02 < 0.03 < 0.002

The Sn99.3Cu0.7 lead free solder bar is made up of 99.7% tin and 0.7% copper. It is desirable for use in common metal equipment, copper tubes, and copper plates. This product is a conventional type of environmentally-friendly solder by adoption of lead-free soldering technology.

As a typical type of high-temperature lead free tin bar, our Sn99.3Cu0.7 lead free solder has the melting point of approximately 227 degrees Celsius. It is suitable for both wave soldering and dip soldering processes, which call for environmental protection. During the soldering process, this product features nice liquidity. It can substantially reduce various technical problems, such as bridging, icicle, solder spatter, and more.


  1. Eutectic alloy.
  2. Bridge-free and icicle-free soldering.
  3. Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate.
  4. Good through-hole penetration.
  5. Good topside fillet formation.
  6. Dross rate equal or lower than tin-lead solder.
  7. Does not require a nitrogen atmosphere.
  8. Does not erode copper from holes, pads and tracks.
  9. Low rate of copper leaching makes it easy to control the copper content of the solder bath.
  10. Lower aggressiveness to stainless steel and other solder pot materials as compared to tin-silver-copper alloys.
  11. Thermal fatigue resistance and creep strength better than tin-lead.
  12. Slow, even growth of the intermetallic layer at the solder/substrate interface.
  13. Also performs well in selective and dip soldering.


  1. Dip soldering or Wave soldering of electronic components such as PCBA, THT
  2. Soldering of metals, such as copper roofing joinery
  3. Assembly of stained glass, silver jewelry etc
  4. Other generally tinning purpose.

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