Solder Bar SAC0307

Products

Lead Free Solder Bars

Leaded Solder Bars

Composition

Sn	Ag	Cu	Pb	Sb	Bi	Zn	Fe	Al	As	Cd
Residue Content	0.3±0.1	0.7±0.2	< 0.1	< 0.1	< 0.06	< 0.001	< 0.02	< 0.001	< 0.03	< 0.002

Physical Properties

Alloy Component	Melting Point, ℃	Tensile Strength, g/cm3	Rigidity HB	Heat Conductivity M.S.K	Tensile Strength, MPa	Elongation Rate, %	Electric Conductivity, %
Sn99Ag0.3Cu0.7	230	7.4	9	64	32	48	16.0

Features

The Sn99.0 Ag0.3 Cu0.7 solder wire is applicable for precise LED and mobile phone chips. The Sn99Ag0.3Cu0.7 solder bar is ideal for use in the hi-tech wave soldering machines as well as the small-sized tin furnaces. Moreover, our product can be applied in the printed circuit board (PCB) and the stainless steel products.

Eutectic alloy.
Bridge-free and icicle-free soldering.
Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate.
Good through-hole penetration.
Good topside fillet formation.
Dross rate equal or lower than tin-lead solder.
Also performs well in selective and dip soldering.

Solder Bar SAC0307

Products

Composition

Physical Properties

Features

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