Solder Bar SAC0307


Lead Free Solder Bars


Leaded Solder Bars


Sn Ag Cu Pb Sb Bi Zn Fe Al As Cd
Residue Content 0.3±0.1 0.7±0.2 < 0.1 < 0.1 < 0.06 < 0.001 < 0.02 < 0.001 < 0.03 < 0.002

Physical Properties

Alloy Component Melting Point, ℃ Tensile Strength, g/cm3 Rigidity HB Heat Conductivity M.S.K Tensile Strength, MPa Elongation Rate, % Electric Conductivity, %
Sn99Ag0.3Cu0.7 230 7.4 9 64 32 48 16.0


The Sn99.0 Ag0.3 Cu0.7 solder wire is applicable for precise LED and mobile phone chips. The Sn99Ag0.3Cu0.7 solder bar is ideal for use in the hi-tech wave soldering machines as well as the small-sized tin furnaces. Moreover, our product can be applied in the printed circuit board (PCB) and the stainless steel products.

  1. Eutectic alloy.
  2. Bridge-free and icicle-free soldering.
  3. Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate.
  4. Good through-hole penetration.
  5. Good topside fillet formation.
  6. Dross rate equal or lower than tin-lead solder.
  7. Also performs well in selective and dip soldering.

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VIGSON SOLDER offers high quality Leaded and Lead free Solder Bars

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