Solder Bar 50/50

Products

Lead Free Solder Bars

 

Leaded Solder Bars

Composition

Sn Cu In Pb Sb Bi Zn Fe Al As Cd
50.0±0.4 0.2±0.1 < 0.01 50.0±0.4 < 0.02 < 0.01 < 0.005 < 0.02 < 0.02 < 0.03 < 0.002

Our Sn50Pb50 tin lead solder bar possesses the melting point of approximately 200 degrees Celsius and the working temperature of 250 degrees Celsius. Sn50Pb50 means that the alloy of soldering wire consists of the 50% tin content and the 50% lead content.

Applications

The Sn50Pb50 tin lead solid solder wire and solder bar can be used for the soldering of stainless steel, zinc alloy, aluminum lamp cap, and some others in the automotive and electronics industries. This type of product is particularly suitable for the manual welding work, component installation, surface mount technology, as well as the repair welding process.

Features

  1. Fast Melting Speed, Superb Wettability and Terrific Expandability
    The tin wire is added with the no-clean activated rosin flux, featuring fast melting speed, superb wettability and terrific expandability. Thereby, it can offer distinguished soldering effect.
  2. Wonderful Electrical Conductivity, No Core Breakage, and No Splash
  3. High Melting Point
    This Sn50Pb50 tin lead solid solder wire is formed by tin and lead. The leaded tin wire manufactured is characterized by high melting point, superb softness and nice wetting property.
  4. Satisfactory Solder Joint and Favorable Fluidity

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VIGSON SOLDER offers high quality Leaded and Lead free Solder Bars

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